This study is led by Ying Zhang (doctoral student, Institute of Microelectronics, Chinese Academy of Sciences) and Dr. Xiaolong Zhao (postdoctor, School of Microelectronics, University of Science and ...
Scaling (the shrinking of the tiny devices in chips such as transistors and memory cells) has never been easy, but making the next generation of advanced logic and memory devices a reality requires ...
Multi-layer 3-dimensional (3D) vertical RRAM (VRRAM) PUF with in-cell stabilization scheme to improve both cost efficiency and reliability. The proposed PUF features excellent resistance against ...
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