Next-generation semiconductor products increasingly rely on vertical integration technologies to drive system density, speed, and yield improvement. Due to the increased coupling effects across ...

Activity around 3D heterogeneous integration (3DHI) is heating up, driven by growing support from governments, the need to add more features and compute elements into systems, and a widespread ...

3D IC chiplet-based heterogeneous package integration represents the next major evolution in semiconductor design. It allows us to continue scaling system performance despite the physical limitationA ...

Fan-out wafer-level packaging (FOWLP) is becoming a critical technology in advanced semiconductor packaging, marking a significant shift in system integration strategies. Industry analyses show 3D IC ...

Why co-optimization is needed when designing 2.5D and 3D chips. The tools provided by Siemens for 2.5D and 3D chip design and packaging. The latest high-performance chips often employ 2.5D and 3D chip ...

Yiqi is a thought leader in Digital Journal’s Insight Forum (become a member). In the rapidly evolving landscape of design, the integration of 3D technology is no longer a niche reserved for animation ...

Researchers from Penn State have demonstrated a novel method of 3D integration using 2D materials. This advancement, detailed in their recent study, addresses the growing challenge of fitting more ...

Jade Myers’ experience in Haiti several years ago helping refugees after a devastating earthquake left an impression that is inspiring her work today as a researcher in prosthetics and accessibility.

Market Research Future forecasts 20% annual growth driven by tech advancements, sustainability, and adoption across aerospace ...